8.0 YES Products

Yield Engineering Systems (YES) builds process control equipment to serve the needs of the semiconductor, biotech, and nanotech industries. YES equipment enables precise surface modification--surface cleaning, process curing, and thin film coating. Depending on your need, surfaces can be super water resistant (hydrophobic) or adhesive (hydrophilic).

Applications include photoresist adhesion for semiconductor wafer fabrication, MEMS coatings to reduce static friction (anti-stiction), bioMEMS coating to promote biocompatibility, and modification of silicon chips and slides used for microarray processing (DNA, gene, protein, tissue, antibodies).

YES product lines:
8.1 Polyimide Cure Ovens  (polyimide, BCB, low temp polymers cure,  low-k dielectrics and copper anneal)

YES-VertaCure (fully automated)

The YES-VertaCure automated, high temperature cure series of ovens is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution Layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.
The system incorporates the laminar flow technology of the YES-PB series. It accommodates 200 and 300mm wafers with one or two load ports and a wafer handling robot inside an integrated Class 1 mini-environment. Up to 50 wafers are loaded into a stainless steel cassette-type rack on the oven chamber door and, when loading is complete, lifted up into the vacuum chamber.

YES-PB Series (manual batch load)
  • YES 6-2P-CP Specs (150 mm wafers)
  • YES 8-2P-CP Specs (200 mm wafers)
  • YES 12-2P-CP Specs (300 mm wafers)
  • Process Management Software (option)
  • Stainless Steel Process Cassettes (accessories)

The YES-PB Series manual load high temperature cure oven is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-PB Series helps achieve total environmental control to increase yields and extend device performance.
8.2 Vapor Phase Deposition Systems (precise silane deposition using significantly less chemical)

Precise Surface Modification and Coating for Nanoscale Dimensions
[YES-VertaCoat] Products in the medical industry require a diversity of surfaces from molecular specific bonding sites for DNA microarrays to enhanced biocompatible surfaces for medical devices.  Products as diverse Microelectromechanical Systems (MEMS) also require hydrophobic surfaces to minimize stiction.  As technology advances, the need for precise and reproducible control over nanoscale surface areas increases.  While RF plasma can modify surface energies, the coating of functionally diverse organosilanes provides the ability for precise surface modification. 

  • YES-VertaCoat (fully automated)

  • YES-ÉcoCoat (Formerly YES-1224P - manual batch load; with plasma)

  • YES-LabCoat (R&D-tabletop size)
8.3 High Vacuum Ovens

  • YES-VertaVac Series
  • YES-PB-HV Series

Microelectromechanical Systems (MEMS) typically have moving parts that are sensitive to the operating pressure, the partial pressure of water vapor in the package, or both. For example, infrared sensors need to operate in a pressure <10-3 Torr in order to be thermally isolated from the outside world and maintain adequate sensitivity. MEMS gyros increase in their sensitivity as the pressure in a package decreases. Water vapor can also cause stiction, where device components are “glued” together by thin films of water and unable to function.

When creating a high-reliability MEMS package, it is imperative to have complete moisture removal prior to hermetic sealing the package. After packaging, moisture removal is required over the lifetime of the MEMS device. Maintaining a controlled ambient in a packaged MEMS depends on the use of getters that absorb the outgassed species from the packaging materials that would otherwise degrade the vacuum environment.

Successful devices and package systems require a good vacuum or a controlled ambient. For optimal performance, the following must occur:

  • Proper processing to reduce trapped gases in the package
  • Hermetically sealing the package
  • Providing a means to absorb gases that outgas into the package

The YES-VertaVac automated ovens and the YES-PB-HV (High Vacuum) manual load ovens provide the processing environment which allows both a degas/ moisture abatement process for the MEMS devices and a getters activation process in a single tool.

8.4 Plasma Strip/Descum Systems
(powerfully strips tough layers of photoresist and polyimides)

  • YES-CV200RFS

YES plasma stripping systems remove thick layers of photoresist and polyimide in the shortest amount of production time. Powerful plasma stripping "sandblasts" tough resist in an automated, user-friendly system. Or, for gentler cleaning operations, the "descum" function can be selected at the switch of a button.
Plasma cleaning technology replaces hazardous and messy wet chemical processes previously used to strip thick layers of photoresist and polyimide. Plasma stripping systems are effective for tough jobs as well gentler applications such as descumming and removing organics.
8.5 Plasma Cleaning Systems (gently cleans substrates without using hazardous solvents)

  • YES-G1000 (4 powered shelves)
  • YES-G500 (2 powered shelves)
  • YES-G1000LMC (loaded magazine cleaner)

The use of plasma is an effective way to clean without using hazardous solvents. Plasma is an ionized gas capable of conducting electricity and absorbing energy from an electrical supply. When a gas absorbs electrical energy, its temperature increases causing the ions to vibrate faster and “scrub” a surface.
Typically, plasma is created in a low-pressure environment. Plasma cleaning systems are an effective way to remove small amounts of contaminants from a substrate surface. (For removing thick photoresist layers, see our Plasma Photoresist Strip/Descum Systems).
8.6 HMDS Prime Ovens + Image Reversal  (pairs dehydration + low pressure for superior HMDS/substrate bonds and negative images are formed with same ease as positive resist)

  • YES-310TA
  • YES-58TA

The HMDS prime process provides a "one-stop" environment for substrate dehydration and vapor deposition of hexamethyldisilizane (HMDS). Because of HMDS lithography preprocessing, YES systems give an HMDS prime layer with superior uniformity and stability.

In wafer fabrication, silane deposition is needed to promote the chemical adhesion of an organic compound (photoresist) to a non-organic substrate (wafer). The silane acts as a sort of "bridge," with properties that will bond to both the photoresist and wafer surface. Typically, hexamethyldisilizane (HMDS) is used.

Old wet processes for depositing silane generated a substantial amount of hazardous waste. Plus, the coating had a limited lifespan, meaning a process engineer had a small window of time to apply photoresist before the bond would degrade.

But today, using the HMDS prime process, you can significantly extend time available between process steps. Plus, chemical usage for a vapor deposition process is typically less than 1% of the amount needed for wet application processes, significantly reducing waste and chemical costs.
8.7 Stainless Steel Process Cassettes (endure high temperatures and repeated use)
  • Cassettes
  • Handlers

Yield Engineering Systems (YES) stainless steel cassettes are ideal for polyimide bake, BCB cure, copper anneal, as well as other cure processes.YES cassettes can be used throughout the clean room in semiconductor fabrication processes where plastic or quartz cassettes are inappropriate or do not perform as well.

YES cassettes are designed to SEMI specifications and mate to most plastic cassettes, so they can be used on all automated vertical or horizontal transfer systems. (Note: our low profile cassettes, designed for easier manual loading of cassettes inside YES systems, are not compatible with automated vertical transfer systems). All cassette designs, including low profile, are compatible with manual push or slide transfer.