Vacuum Bake/Vapor Prime Systems
- YES-3TA - Vacuum bake/Vapor prime
- YES-5TA - Image Reversal
- YES-FPO - Dual Function (Vacuum bake/Vapor Prime - Image Reversal)
By using the vacuum bake/vapor prime process, you can significantly extend time available between process steps. Plus, chemical usage for a vapor
deposition process is typically less than 1% of the amount needed for wet application processes, significantly reducing waste and chemical costs.
YES-TA Series benefits include:
- Precise HMDS application
- More time available between process steps
- Less chemical usage
- Stable process results
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Image Reversal Tools (negative images are formed with same ease as positive resist)
The image reversal process reverses the action of positive resist so negative images can be formed with the same resolution and processing ease that a
positive resist allows. What's more, image reversal allows variations of the slope of the photoresist sidewall for higher resolution and/or lift off profiles
- YES-8TA
- YES-10TA
- YES-310TA (+ vapor prime)
- YES-58TA (+ vapor prime)
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Vapor Deposition Systems (precise silane deposition using significantly less chemical)
- YES-1224
- YES-1224P (with plasma cleaining option)
Vapor Deposition is a process widely used in the semiconductor and biotechnology industries for the deposition of a thin film of various materials in order
to achieve surface modification. vapor deposition enables nano-precise control and run-to-run repeatability of your process.
Whether you need a slick (hydrophobic) surface coating for microelectromechanical systems (MEMS) or a sticky (hydrophilic) surface for semiconductor or
microarray processing, silane vapor deposition is especially suited for achieving uniform results.
Complete dehydration followed by vapor deposition coating provides a superior silane/substrate bond that is stable after exposure to atmospheric moisture,
extending the time available between process steps. Chemical usage for a vapor deposition process is typically less than 1% of the amount needed for wet
application processes, significantly reducing waste and chemical costs.
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High Temperature Vacuum Cure Ovens
- YES-450PB Series
- YES-PBV300 (automated wafer handling)
YES ovens are designed to give total parameter control over your process, in a clean environment. Wafers placed in a YES high temperature vacuum oven
stay clean, so you get the results you want. YES ovens provide an ideal processing environment for curing:
- Low-K dielectrics
- Polyimide
- BCB
- Copper anneal
Process Benefits
Pulling a vacuum in a series of nitrogen purge cycles removes oxygen, moisture and atmospheric contaminants. Running at 250 Torr (1/3 of atmosphere)
gently draws out solvents in a gentle vertical laminar flow that removes particles. Processing at reduced pressure prevents a problematic heat reaction, in
which a hard skin forms on the top of polyimide film before it is completely baked and traps solvents.
1. Cleaner Process. The vacuum is pulled from the bottom of the oven, and preheated nitrogen enters from above and goes through a restraining stainless steel
flat plate filter. This induces vertical flow and the constant removal of particles from the substrate. Plus, as a bonus, a vacuum process significantly reduces
the amount of nitrogen flow required compared to atmospheric ovens.
2. Uniform Solvent Evaporation. The constant vacuum and hot nitrogen mix pulls out the solvent with more efficiency. It also provides a gentle laminar flow
to remove particles. (Older methods of heating polyimide relied on dwell steps to allow the substrate to heat up and boil out solvent).
3. Consistency. Using a vacuum provides tighter control of your process. Processing conditions are very repeatable because of reduced pressure combined
with temperature profile of ramp baked.
4. Temperature Uniformity. Using a vacuum allows an adjustable air-mixing ratio for chamber cooling to adapt the tool for best performance over a broad
range of operating temperatures. (Vacuum + pre-heated nitrogen gives control of process atmosphere).
5. (Almost) No Oxygen. Using a vacuum achieves oxygen levels below 10ppm during processing. All of our polyimide bake ovens have double door seals,
creating a nitrogen "buffer" between the outside atmosphere and the inside chamber.
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Plasma Photoresist Strip/Descum Systems
- YES-CV200RF and YES-CV200RFS
YES plasma stripping systems remove thick layers of photoresist and polyimide in the shortest amount of production time. Powerful plasma stripping
"sandblasts" tough resist in an automated, user-friendly system. Or, for gentler cleaning operations, the "descum" function can be selected at the switch of a
button.
Plasma cleaning technology replaces hazardous and messy wet chemical processes previously used to strip thick layers of photoresist and polyimide.
Plasma stripping systems are effective for tough jobs as well gentler applications such as descumming and removing organics.
Applications:
- Photoresist removal
- Polyimide removal
- Organics removal
- Etching
- Surface preparation
- CD master cleaning
- Descumming
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Plasma Cleaning Systems
- YES-G500 (2 powered shelves)
- YES-G1000 (4 powered shelves)
- YES-G1000LMC (loaded magazine cleaner)
The use of plasma is an effective way to clean without using hazardous solvents. Plasma is an ionized gas capable of conducting electricity and absorbing
energy from an electrical supply. When a gas absorbs electrical energy, its temperature increases causing the ions to vibrate faster and “scrub” a surface.
Typically, plasma is created in a low-pressure environment. Plasma cleaning systems are an effective way to remove small amounts of contaminants from a
substrate surface. (For removing thick photoresist layers, see our Plasma Photoresist Strip/Descum Systems).
Typical Applications:
- Wire bond surface preparation
- Removing contaminants (flux) or sterilizing a surface
- Promoting adhesion between two surfaces
- Controlling surface tension to achieve either a hydrophobic or hydrophilic surface
- Increasing biocompatibility
- Improving polymer performance through cross-linking to decrease friction that wears out devices
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SECS/GEM
The SECS/GEM interface is the semiconductor industry's standard for equipment-to-host communications. In an automated fab, the interface can start and
stop equipment processing, collect measurement data, change variables and select recipes for products. The SECS/GEM standards do all this in a defined
way.
Developed by the SEMI (Semiconductor Equipment and Materials International) organization, the standards define a common set of equipment behavior and
communications capabilities.
The package includes SEMI E5-0308 and SEMI E30-0307 host communications and control. Host communications requires a Linux PC (supplied by YES)
installed near the tool. The SECS/GEM PC uses an RS-232 serial communications link to communicate with the tool control PLC. The SECS/GEM PC
communicates with the host, using the HSMS Standard (E37), through a network connection.
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Stainless Steel Process Cassettes
Yield Engineering Systems (YES) stainless steel cassettes are specifically designed for use with the YES-450PB Series high temperature vacuum cure ovens.
They are ideal for polyimide bake, BCB cure, copper anneal, as well as other cure processes.YES cassettes can be used throughout the clean room in
semiconductor fabrication processes where plastic or quartz cassettes are inappropriate or do not perform as well
YES cassettes are designed to SEMI specifications and mate to most plastic cassettes, so they can be used on all automated vertical or horizontal transfer
systems. (Note: our low profile cassettes, designed for easier manual loading of cassettes inside YES systems, are not compatible with automated vertical
transfer systems). All cassette designs, including low profile, are compatible with manual push or slide transfer.
Benefits
- No particles
- Automated or manual transfer
- Uniform substrate temperature processing
- Best temperature performance for YES-450PB Series ovens
- Lightweight design
- Available in vertical and horizontal
- Designed to SEMI specifications
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